L3 Narda-MITEQ 4322-2

Package / Case

Module, SMA Connectors

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

1.563Lx1.700W x 0.375 H 39.69mmx43.18mmx9.52mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SMA-F, ISOLATION-MIN (DB):18

Construction

COAXIAL

Frequency

500MHz~2.5GHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 18dB, 1.35 VSWR (Max)

RF/Microwave Device Type

SPLITTER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.3dB

VSWR-Max

1.15

Input Power-Max (CW)

44.77dBm