L3 Narda-MITEQ 4314B-2

Package / Case

Module, SMA Connectors

Operating Temperature (Max.)

85°C

Operating Temperature (Min.)

-55°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

0.875Lx1.010W x 0.375 H 22.22mmx25.65mmx9.52mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

SMA-F, ISOLATION-MIN (DB):20

Construction

COAXIAL

Frequency

2GHz~8GHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 20dB, 1.35 VSWR (Max)

RF/Microwave Device Type

SPLITTER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

0.6dB

VSWR-Max

1.25

Input Power-Max (CW)

44.77dBm