L3 Narda-MITEQ 2382-2

Package / Case

Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

3.500Lx2.500W x 1.000 H 88.90mmx63.50mmx25.40mm

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Frequency

500MHz~6GHz

Specifications

a measure of a material's ability to?conduct heat.?

Isolation (Min) 17dB, 2.2 VSWR (Max)

RF/Microwave Device Type

SPLITTER AND COMBINER

Insertion Loss

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

1.5dB