KYOCERA SMP-TCG104XGAN30-15069-2

Mounting Type

Through Hole, Right Angle

Series

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Press-Fit

Connector Type

SFP

Number of Positions

160 (20 x 8)

Contact Finish

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Connector Style

Receptacle with Cage, Ganged (2x4)

Features

Board Guide, EMI Shielded, Light Pipe

Contact Finish Thickness

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