KYOCERA 589296002001996

Mounting Type

Surface Mount

Material

FR4 Epoxy Glass

Package Accepted

TSSOP

Package

Bulk

Base Product Number

LCQT-TS

Mfr

Aries Electronics

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

400

Manufacturer

KYOCERA AVX

Brand

KYOCERA AVX

RoHS

Details

Series

Correct-A-Chip®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Size / Dimension

1.400 L x 0.700 W (35.56mm x 17.78mm)

Connector Type

Individual Wires

Number of Positions

28

Color

-

Number of Rows

1

Subcategory

Board to Board & Mezzanine Connectors

Pitch

0.026 (0.65mm)

Number of Positions Loaded

All

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

18 AWG

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

-

Cable Termination

Cable Termination is the connection of the wire or fiber to a device, such as equipment, panels or a wall outlet, which allows for connecting the cable to other cables or devices.

Poke-In

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Board to Board & Mezzanine Connectors

Cable Pitch

-

Proto Board Type

SMD to DIP

Board-Side Pitch

-

Features

Closed End

Product Category

a particular group of related products.

Board to Board & Mezzanine Connectors

Contact Finish Thickness

-

Board Thickness

0.062 (1.57mm) 1/16