Kycon, Inc. KPCIEX-T36-3BK30

Factory Lead Time

20 Weeks

Mounting Type

Through Hole

Material - Insulation

Thermoplastic

Board Mounting Option

PEG

Contact Materials

Phosphor Bronze

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

KPCIEX

Published

2014

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Solder

ECCN Code

EAR99

Connector Type

CARD EDGE CONNECTOR

Number of Positions

36

Color

Black

Number of Rows

2

Gender

Female

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Contact Type

Cantilever

Mixed Contacts

NO

Option

GENERAL PURPOSE

Pitch

0.039 1.00mm

Total Number of Contacts

36

Number of Conductors

ONE

Contact Finish

Gold

Reliability

COMMERCIAL

Body Length or Diameter

0.984 inch

Number Of PCB Rows

4

PCB Contact Pattern

STAGGERED

Body Depth

0.443 inch

Rated Current (Signal)

1.1A

Contact Resistance

30mOhm

Card Type

PCI Express™

Read Out

the process of removing information from an automatic device (such as a computer or sensor) and displaying it in an understandable form.

Dual

Insulation Resistance

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

1000000000Ohm

Body/Shell Style

PLUG

Dielectric Withstanding Voltage

700VAC V

Features

Board Guide, Locking Ramp

Contact Finish Thickness

30.0μin 0.76μm

Plating Thickness

30μin

Card Thickness

0.062 1.57mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant