Kioxia America, Inc. TC58NVG1S3EBAI5

Package / Case

TFBGA-63

RoHS

Details

Mounting Styles

SMD/SMT

Interface Type

Parallel

Timing Type

Synchronous

Supply Voltage-Min

2.7 V

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Active Read Current - Max

30 mA

Maximum Clock Frequency

-

Memory Types

NAND

Moisture Sensitive

Yes

Factory Pack QuantityFactory Pack Quantity

180

Supply Voltage-Max

3.6 V

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

2 Gbit

Speed

25 ns

Supply Current-Max

30 mA

Architecture

Block Erase

Data Bus Width

8 bit

Organization

256 M x 8

Product

NAND Flash