08EP08-N3GTC32-GA67

Kingston 08EP08-N3GTC32-GA67

Part No:

08EP08-N3GTC32-GA67

Manufacturer:

Kingston

Datasheet:

-

Package:

136-FBGA

AINNX NO:

28678765-08EP08-N3GTC32-GA67

Category:

Memory

Description:

EPOP 8GB EMMC 8Gb LPDDR3 X8/X32

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    136-FBGA
  • Supplier Device Package
    136-FBGA (10x10)
  • Mfr
    Kingston
  • Package
    Tray
  • Product Status
    Active
  • Memory Types
    Non-Volatile, Volatile
  • Base Product Number
    08EP08
  • Moisture Sensitive
    Yes
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Unit Weight
    0.005714 oz
  • Minimum Operating Temperature
    - 25 C
  • Factory Pack QuantityFactory Pack Quantity
    152
  • Mounting Styles
    SMD/SMT
  • Interface Type
    eMMC 5.1
  • Manufacturer
    Kingston
  • Brand
    Kingston
  • RoHS
    Details
  • Series
    -
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -25°C ~ 85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Subcategory
    Memory & Data Storage
  • Voltage - Supply
    1.8V, 3.3V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8GByte (NAND), 8Gbit (LPDDR3 DRAM)
  • Memory Format
    FLASH, RAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    eMMC 5.1 HS400 + LPDDR3
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Multichip Packages
  • Product Category

    a particular group of related products.

    Multichip Packages
  • Memory Organization
    -
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