Kester Solder 24-6337-9702

Factory Lead Time

5 Weeks

Weight

453.59237g

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Spool

Series

285

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Wire Solder

Composition

Sn63Pb37 (63/37)

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

24 AWG, 25 SWG

Storage/Refrigeration Temperature

50°F~104°F 10°C~40°C

Form

Spool, 1 lb (454 g)

Process

Leaded

Melting Point

361°F 183°C

Flux Type

Rosin Mildly Activated (RMA)

Diameter

0.020 0.51mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Lead Free