Kepco and Kepco Power BOP 2X100-1DC

Base Product Number

BOP 2X100

Series

BOP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

17.142" L x 12.531" W x 5.220" H (435.40mm x 318.30mm x 132.60mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Rack Mount (AC to DC)

Power (Watts)

100W

Voltage - Supply

95 ~ 250VAC

Current - Output

0 ~ 1A

Voltage - Output

0 ~ 100VDC

Display Type

LCD

Features

GPIB, RS-232