KEMET VJ1206Y104KXBAT

Package / Case

1206

Number of Terminals

2

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8532.24.00.20

Automotive

No

PPAP

No

Capacitance Value

0.1uF

Microwave Application

No

Special Features

Wide Range Of Case Sizes, Voltage Ratings and Capacitance Values

Mounting

Surface Mount

Case Style

Ceramic Chip

Dissipation Factor (%)

2.5

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Product Depth (mm)

1.6

Length Tolerance (mm)

±0.25

Depth Tolerance (mm)

±0.25

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Tolerance

10%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Construction

Flat

Termination Style

Pad

Dielectric

X7R

Voltage

100VDC

Size(mm)

3.2 X 1.6 X 1.71

Product Length (mm)

3.2

Product Height (mm)

1.71(Max)