KEC TIP42CF

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Weight

0.8 kg

Number of Terminals

3

Transistor Element Material

SILICON

Exterior Housing Material

1

Gross Weight

820.00

Analogue

POS40

Execution

wire

Melting temperature

183...240 °C

Part Life Cycle Code

Active

Ihs Manufacturer

KEC CORP

Part Package Code

TO-220AB

Package Description

TO-220IS, 3 PIN

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Transition Frequency-Nom (fT)

3 MHz

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

coil

ECCN Code

EAR99

Type

Soft Tin-Lead Solder Sn/Pb

Composition

tin - 40%; lead - 60%

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE

Case Connection

ISOLATED

Polarity/Channel Type

PNP

JEDEC-95 Code

TO-220AB

Collector Current-Max (IC)

6 A

DC Current Gain-Min (hFE)

15

Collector-Emitter Voltage-Max

100 V

Diameter

1.2 mm