Kaga FEI America, Inc. MB86R01PB-GSE1

Mounting Type

Surface Mount

Package / Case

484-BGA

Supplier Device Package

484-BGA (23x23)

Programmable

Not Verified

Number of I/Os

24

Base Product Number

MB86R01

Series

Jade

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 85°C

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Applications

Graphics Controller

Voltage - Supply

1.1V ~ 3.6V

Interface

ADC, ATA, CAN, EBI/EMI, I2C, I2S, Media LB, PWM, SD Card, UART/USART, USB

RAM Size

64K x 8

Core Processor

ARM9®

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

External Program Memory

Controller Series

Jade