MB85AS8MTPWG-KBCERE1

Kaga FEI America, Inc. MB85AS8MTPWG-KBCERE1

Part No:

MB85AS8MTPWG-KBCERE1

Datasheet:

-

Package:

11-XFBGA, WLBGA

AINNX NO:

68758208-MB85AS8MTPWG-KBCERE1

Category:

Memory

Description:

IC RAM 8MBIT SPI TYPE C 11WLCSP

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    11-XFBGA, WLBGA
  • Supplier Device Package
    11-WLP (2.07x2.88)
  • Mfr
    Kaga FEI America, Inc.
  • Programmable
    Not Verified
  • Memory Types
    Non-Volatile
  • Base Product Number
    MB85AS8
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Voltage - Supply
    1.6V ~ 3.6V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8Mbit
  • Clock Frequency
    10 MHz
  • Access Time
    35 ns
  • Memory Format
    RAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI
  • Write Cycle Time - Word, Page
    10ms
  • Memory Organization
    1M x 8
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