J.W. Winco 333.1-28-16-A-ES

Mounting Type

Screw Holes, Back

Material

Aluminum

Base Product Number

333.1

Series

GN 333.1

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Instrumentation

Thread/Screw/Hole Size

M8

Height

2.600" (66.04mm)

Length - Center to Center

15.750" (400.05mm)