J.W. Winco 13TLVT/DN

Mounting Type

Threaded Stud

Material

Plastic

Shape

Cylindrical, Recessed Center

Base Product Number

13TLVT

Series

LPSO

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

2.500" Dia (63.50mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Foot

Thickness

0.350" (8.89mm)