J.W. Winco 12NTNS

Mounting Type

Threaded Stud

Material

Rubber

Shape

Cylindrical, Recessed Center

Series

TNSM

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Size / Dimension

1.880" Dia (47.75mm)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Foot

Color

Black

Thickness

0.310" (7.87mm)