24-6040-0066-JVP
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69842433-24-6040-0066-JVP
0.093" Diameter 60% Tin 40% Lead 500g Solder Roll
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
24-6337-0027-JBP
Jameco BenchPro0.031" Diameter 63% Tin 37% Lead Solder with Flux 500g Roll83-4000-0000-JBP
Jameco BenchPro0.031" Diameter 60% Tin 40% Lead Solder with Flux Pocket Pack 15g24-6040-0066-JVP
Jameco BenchPro0.093" Diameter 60% Tin 40% Lead 500g Solder Roll24-6040-0061-JVP
Jameco BenchPro0.062" Diameter 60% Tin 40% Lead Solder with Flux 500g Roll83-4000-0000-JVP
Jameco BenchPro0.031" Diameter 60% Tin 40% Lead Solder with Flux Pocket Pack 15g24-6040-0066-JBP
Jameco BenchPro0.093" Diameter 60% Tin 40% Lead 500g Solder Roll24-6040-0061-JBP
Jameco BenchPro0.062" Diameter 60% Tin 40% Lead Solder with Flux 500g Roll24-6337-0027-JVP
Jameco BenchPro0.031" Diameter 63% Tin 37% Lead Solder with Flux 500g Roll83-6337-0027-JVP
Jameco BenchPro0.031" Diameter 63% Tin 37% Lead Solder with Flux Pocket Pack 15g83-3000-0000-JVP
Jameco BenchPro0.05" Diameter 60% Tin 40% Lead Solder Pocket Pack