SF15W006S4BR2000

JAE Electronics SF15W006S4BR2000

Part No:

SF15W006S4BR2000

Manufacturer:

JAE Electronics

Package:

-

ROHS:

AINNX NO:

5763107-SF15W006S4BR2000

Description:

MICROSIM HINGE STYLE

Products specifications
  • Factory Lead Time
    14 Weeks
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount, Right Angle
  • Mounting Feature

    a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

    Normal, Standard - Top
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    SF15
  • Published
    2014
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Connector Type
    Connector and Ejector
  • Number of Positions
    6
  • Contact Finish
    Gold
  • Card Type
    Micro SIM
  • Insertion, Removal Method
    Hinged Lid
  • Contact Finish Thickness
    19.7μin 0.50μm
  • Height Above Board
    0.061 1.55mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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