JAE Electronics FI-XB30SSRL-HF16-R2500

Mounting Type

BOARD

RoHS

Details

Factory Pack QuantityFactory Pack Quantity

2500

Contact Finish Mating

NOT SPECIFIED

Rohs Code

Yes

Manufacturer Part Number

FI-XB30SSRL-HF16-R2500

Mounting Styles

RIGHT ANGLE

Number of Rows Loaded

1

Contact Materials

NOT SPECIFIED

Part Life Cycle Code

Obsolete

Ihs Manufacturer

JAPAN AVIATION ELECTRONICS INDUSTRY LTD

Risk Rank

5.84

Series

FI

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Connector Type

FFC/FPC CONNECTOR

MIL Conformance

NO

DIN Conformance

NO

IEC Conformance

NO

Filter Feature

NO

Mixed Contacts

NO

Option

GENERAL PURPOSE

Total Number of Contacts

30

Reach Compliance Code

unknown

Termination Type

SURFACE MOUNT

Product

Board Mount