ITT Cannon, LLC MDM03-D25-04

Factory Lead Time

9 Weeks

Shell Material

ALUMINUM ALLOY

Mounting Option 1

#4-40

Mounting Option 2

JACKPOST

Contact Materials

COPPER ALLOY

Insulation Materials

LIQUID CRYSTAL POLYMER (LCP)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

83513-Style Micro D Metal Shell (MDM)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Termination

Crimp

Connector Type

D-Sub

Type

D-Type, Micro-D

Number of Positions

25

Color

Multiple, Individual

Number of Rows

2

MIL Conformance

YES

Total Number of Contacts

25

Shell Finish

CADMIUM

Contact Finish

Gold

Reliability

MIL-C-83513

Body Breadth

0.308 inch

Contact Gender

FEMALE

Body Depth

0.106 inch

Rated Current (Signal)

3A

Contact Style

RND PIN-SKT

Contact Resistance

8mOhm

Insulation Resistance

The measurement of insulation resistance is carried out by means of a megohmmeter – high resistance range ohmmeter. A general rule-of-thumb is 10 Megohm or more.

5000000000Ohm

Mating Contact Pitch

0.05 inch

Dielectric Withstanding Voltage

900VAC V

Cable Length

A nautical unit of measure equal to one tenth of a nautical mile or approximately 1 fathoms.

914mm

Contact Pattern

STAGGERED

Insertion Force-Max

2.224 N

Withdrawl Force-Min

.139 N

1st Connector

Plug, Male Pins

2nd Connector

Individual Wire Leads

Contact Design

PREASSEM CONN

Wire Size (Min)

32 AWG

Wire Size (Max)

26 AWG

Length

3.00' 914.40mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant