ITT 227-1035-018

Mounting Type

Through Hole

Series

600

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Termination

Solder

Connector Type

DIP, DIL - Header

Number of Positions

16

Color

Black

Number of Rows

2

Contact Type

Slotted

Pitch

0.100 (2.54mm)

Contact Finish

Gold

Row Spacing

the space needed between rows to allow room for people or farm equipment to get through.

0.300 (7.62mm)

Features

--

Contact Finish Thickness

20.0µin (0.51µm)