IS25WP512M-RHLE-TR

ISSI, Integrated Silicon Solution Inc IS25WP512M-RHLE-TR

Part No:

IS25WP512M-RHLE-TR

Package:

24-TBGA

AINNX NO:

68750095-IS25WP512M-RHLE-TR

Category:

Memory

Description:

IC FLSH 512MBIT SPI/QUAD 24TFBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    24-TBGA
  • Supplier Device Package
    24-TFBGA (6x8)
  • Mfr
    ISSI, Integrated Silicon Solution Inc
  • Programmable
    Not Verified
  • Memory Types
    Non-Volatile
  • Qualification
    AEC-Q100
  • Base Product Number
    IS25WP512M
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 105°C (TA)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Voltage - Supply
    1.7V ~ 1.95V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512Mbit
  • Clock Frequency
    112 MHz
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI - Quad I/O, QPI, DTR
  • Write Cycle Time - Word, Page
    50µs, 1ms
  • Grade
    Automotive
  • Memory Organization
    64M x 8
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