X60003BIG3-41T1
TO-236-3
18441013-X60003BIG3-41T1
IC VREF SERIES 4.096V SOT23-3
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
a count of all of the component leads (or pins)
An indicator of formal certification of qualifications.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
The quiescent current is defined as the current level in the amplifier when it is producing an output of zero.
a code object that is not stored directly where it is created, but that acts as a kind of pointer to a value stored elsewhere.
RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.