X28HC256PIZ-12

Intersil (Renesas Electronics America) X28HC256PIZ-12

Part No:

X28HC256PIZ-12

Datasheet:

-

Package:

PDIP-28

AINNX NO:

31587203-X28HC256PIZ-12

Category:

Memory

Description:

EEPROM 32K X 8 EEPROM,CMOS,HIGH SPEED,PDIP,I.TEMP,120NS,PB FREE

Products specifications
  • Package / Case
    PDIP-28
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    28
  • RoHS
    Details
  • Interface Type
    Parallel
  • Supply Voltage-Min
    4.5 V
  • Supply Voltage-Max
    5.5 V
  • Minimum Operating Temperature
    - 40 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Data Retention
    100 Year
  • Factory Pack QuantityFactory Pack Quantity
    13
  • Unit Weight
    0.154853 oz
  • Package Description
    DIP,
  • Package Style
    IN-LINE
  • Number of Words Code
    32000
  • Package Body Material
    PLASTIC/EPOXY
  • Manufacturer Package Code
    E28.628
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    120 ns
  • Operating Temperature-Max
    85 °C
  • Manufacturer Part Number
    X28HC256PIZ-12
  • Number of Words
    32768 words
  • Supply Voltage-Nom (Vsup)
    5 V
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Part Life Cycle Code
    Active
  • Samacsys Description
    EEPROM 256k, 32k x 8-Bit, 5V, Byte Alterable EEPROM
  • Ihs Manufacturer
    RENESAS ELECTRONICS CORP
  • Risk Rank
    5.6
  • Part Package Code
    PDIP
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • JESD-609 Code
    e3
  • Terminal Finish
    Matte Tin (Sn)
  • Technology
    CMOS
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    28
  • JESD-30 Code
    R-PDIP-T28
  • Brand Name
    Renesas
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    5 V
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256 kbit
  • Operating Supply Current
    60 mA
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    ASYNCHRONOUS
  • Access Time
    120 ns
  • Organization
    32 k x 8
  • Seated Height-Max
    6.35 mm
  • Memory Width
    8
  • Memory Density
    262144 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    EEPROM
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    4.5 V to 5.5 V
  • Write Cycle Time-Max (tWC)
    5 ms
  • Height
    4.06 mm
  • Length
    35.6 mm
  • Width
    14 mm
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