Intersil (Renesas Electronics America) HIP6601BECB

Mount

Surface Mount

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2001

JESD-609 Code

e0

Moisture Sensitivity Level (MSL)

2 (1 Year)

Number of Terminations

8

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

85°C

Min Operating Temperature

0°C

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

240

Number of Functions

1

Supply Voltage

12V

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

R-PDSO-G8

Number of Outputs

2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Supply Voltage-Min (Vsup)

10.8V

Current - Output

4.4mA

Interface IC Type

HALF BRIDGE BASED MOSFET DRIVER

Output Peak Current Limit-Nom

0.73A

High Side Driver

YES

Supply Voltage1-Min

5V

Length

4.89mm

Height Seated (Max)

1.68mm

Width

3.9mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Contains Lead