Intersil (Renesas Electronics America) HI3-674AKN-5

Mount

Through Hole

Package / Case

DIP

Number of Pins

28

Power Dissipation (Max)

720mW

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

2001

JESD-609 Code

e0

Number of Terminations

28

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

75°C

Min Operating Temperature

0°C

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Supply Voltage

12V

Terminal Pitch

The center distance from one pole to the next.

2.54mm

Reach Compliance Code

not_compliant

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

28

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

Bipolar, Unipolar

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL EXTENDED

Interface

Parallel

Number of Bits

12

Converter Type

ADC, SUCCESSIVE APPROXIMATION

Supply Type

Dual

Resolution

1.5 B

Sampling Rate

often described in the context of signal processing as the number of samples per time.

67 ksps

Number of Analog In Channels

2

Output Bit Code

BINARY

Sample and Hold / Track and Hold

SAMPLE

Negative Supply Voltage-Nom

-12V

Number of Analog Inputs

1

Length

37.4mm

Height Seated (Max)

6.35mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant

Lead Free

Contains Lead