Intersil (Renesas Electronics America) HA9P2556-9

Package / Case

SOIC

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

16

Operating Temperature (Max.)

85°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Published

1998

JESD-609 Code

e0

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

16

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

240

Number of Functions

1

Supply Voltage

15V

Time@Peak Reflow Temperature-Max (s)

30

Pin Count

a count of all of the component leads (or pins)

16

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Number of Channels

1

Number of Circuits

4

Analog IC - Other Type

ANALOG MULTIPLIER OR DIVIDER

Throw Configuration

DPST

Slew Rate

the maximum rate of output voltage change per unit time.

450 V/μs

Bandwidth

57MHz

Supply Current-Max (Isup)

20mA

Neg Supply Voltage-Nom (Vsup)

-15V

Height Seated (Max)

2.65mm

Width

7.5mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Contains Lead