Intersil R5F562TAADFM#V1

ECCN (US)

3A991

HTS

8542.31.00.01

Family Name

RX

Instruction Set Architecture

CISC

Maximum CPU Frequency (MHz)

100

Maximum Clock Rate (MHz)

100

Data Bus Width (bit)

32

Data Memory Size

32KB

Maximum Expanded Memory Size

4GB

Programmability

Yes

Interface Type

CAN/I2C/SCI/SPI

Number of I/Os

37

No. of Timers

1

Number of ADCs

Triple

ADC Resolution (bit)

12/12/10

USART

0

UART

0

I2C

1

I2S

0

Watchdog

1

Analog Comparators

6

Parallel Master Port

No

Real Time Clock

No

Special Features

CAN Controller

Minimum Operating Supply Voltage (V)

4

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.5

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

CECC Qualified

No

Standard Package Name

QFP

Supplier Package

LFQFP

Mounting

Surface Mount

Package Height

1.4

Package Length

10

Package Width

10

PCB changed

64

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

64

RAM Size

16KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash

Program Memory Size

256KB

Core Architecture

RX

Ethernet

0

USB

0

SPI

1

PWM

1

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

RX

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant