ISL5585ECR

Intersil ISL5585ECR

Part No:

ISL5585ECR

Manufacturer:

Intersil

Datasheet:

-

Package:

32-VQFN Exposed Pad

AINNX NO:

40249224-ISL5585ECR

Description:

SLIC, 2-4 CONVERSION, BIPOLAR

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    32-VQFN Exposed Pad
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Pins
    32
  • Supplier Device Package
    32-QFN (7x7)
  • Number of Terminals
    32
  • Package
    Retail Package
  • Mfr
    Glenair
  • Product Status
    Active
  • RoHS
    Non-Compliant
  • Package Description
    7 X 7 MM, PLASTIC, MO-220VKKC, QFN-32
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
  • Moisture Sensitivity Levels
    3
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom
    3.3 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    ISL5585ECR
  • Package Code
    HVQCCN
  • Package Shape
    SQUARE
  • Manufacturer
    Rochester Electronics LLC
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ROCHESTER ELECTRONICS LLC
  • Risk Rank
    5.18
  • Part Package Code
    QFN
  • Series
    *
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 75°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Pbfree Code
    No
  • Terminal Finish
    NOT SPECIFIED
  • Power (Watts)
    305 mW
  • Technology
    BIPOLAR
  • Voltage - Supply
    3.3V
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Peak Reflow Temperature (Cel)
    240
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    32
  • JESD-30 Code
    S-PQCC-N32
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Qualification Status

    An indicator of formal certification of qualifications.

    COMMERCIAL
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Interface
    -
  • Number of Circuits
    1
  • Current - Supply
    -
  • Seated Height-Max
    1 mm
  • Telecom IC Type
    SLIC
  • Width
    7 mm
  • Length
    7 mm
  • Lead Free
    Contains Lead
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