Intersil IRFP153

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

3

Transistor Element Material

SILICON

Package Style

FLANGE MOUNT

Moisture Sensitivity Levels

NOT SPECIFIED

Package Body Material

PLASTIC/EPOXY

Reflow Temperature-Max (s)

NOT SPECIFIED

Rohs Code

No

Manufacturer Part Number

IRFP153

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Number of Elements

1

Part Life Cycle Code

Active

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.37

Drain Current-Max (ID)

34 A

JESD-609 Code

e0

Pbfree Code

No

Terminal Finish

TIN LEAD

Terminal Position

SINGLE

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

JESD-30 Code

R-PSFM-T3

Qualification Status

An indicator of formal certification of qualifications.

COMMERCIAL

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-247

Drain-source On Resistance-Max

0.08 Ω

Pulsed Drain Current-Max (IDM)

140 A

DS Breakdown Voltage-Min

60 V

FET Technology

METAL-OXIDE SEMICONDUCTOR