Intersil 2N6758

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

2

Transistor Element Material

SILICON

Package Description

FLANGE MOUNT, O-MBFM-P2

Package Style

FLANGE MOUNT

Package Body Material

METAL

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

150 °C

Rohs Code

No

Manufacturer Part Number

2N6758

Turn-on Time-Max (ton)

80 ns

Package Shape

ROUND

Manufacturer

Harris Semiconductor

Number of Elements

1

Part Life Cycle Code

Obsolete

Ihs Manufacturer

HARRIS SEMICONDUCTOR

Turn-off Time-Max (toff)

90 ns

Risk Rank

7.58

Drain Current-Max (ID)

9 A

JESD-609 Code

e0

ECCN Code

EAR99

Terminal Finish

Tin/Lead (Sn/Pb)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

RADIATION HARDENED

Subcategory

FET General Purpose Power

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

PIN/PEG

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

JESD-30 Code

O-MBFM-P2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Configuration

SINGLE WITH BUILT-IN DIODE

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ENHANCEMENT MODE

Case Connection

DRAIN

Transistor Application

SWITCHING

Polarity/Channel Type

N-CHANNEL

JEDEC-95 Code

TO-204AA

Drain Current-Max (Abs) (ID)

9 A

Drain-source On Resistance-Max

0.4 Ω

Pulsed Drain Current-Max (IDM)

15 A

DS Breakdown Voltage-Min

200 V

FET Technology

METAL-OXIDE SEMICONDUCTOR

Power Dissipation-Max (Abs)

75 W

Feedback Cap-Max (Crss)

150 pF

Power Dissipation Ambient-Max

75 W