LOB1R050JLF

International Resistive LOB1R050JLF

Part No:

LOB1R050JLF

Datasheet:

-

Package:

-

AINNX NO:

38795761-LOB1R050JLF

Description:

Products specifications
  • Mount
    Stud
  • Number of Pins
    2
  • RoHS
    Non-Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    50 W
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Max Reverse Leakage Current
    10 µA
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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