TC277TP64F200SCAKXUMA1

International Rectifier TC277TP64F200SCAKXUMA1

Part No:

TC277TP64F200SCAKXUMA1

Datasheet:

-

Package:

0805 (2012 Metric)

AINNX NO:

40846819-TC277TP64F200SCAKXUMA1

Description:

Products specifications
  • Package / Case
    0805 (2012 Metric)
  • Supplier Device Package
    0805
  • Package
    Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
  • Base Product Number
    RNCF0805B
  • Mfr
    Stackpole Electronics Inc
  • Product Status
    Active
  • Number of I/Os
    169
  • Lead Free Status / RoHS Status
    Lead free / RoHS Compliant
  • Other Names
    SP001146098 TC277TP64F200SCAKXUMA1TR
  • Data Converters
    A/D 60x12b, 6 x Sigma-Delta
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 155°C
  • Series
    RNCF
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Size / Dimension
    0.079 L x 0.049 W (2.00mm x 1.25mm)
  • Tolerance
    ±0.1%
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±25ppm/°C
  • Resistance
    750 kOhms
  • Composition
    Thin Film
  • Power (Watts)
    0.125W, 1/8W
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    -
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • Speed
    200MHz
  • RAM Size
    472K x 8
  • Voltage - Supply (Vcc/Vdd)
    3 V ~ 5.5 V
  • Core Processor
    TriCore™
  • Peripherals
    DMA, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit Dual-Core
  • Program Memory Size
    4MB (4M x 8)
  • Connectivity
    ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
  • EEPROM Size
    64K x 8
  • Features
    Automotive AEC-Q200
  • Height Seated (Max)
    0.026 (0.65mm)
  • Ratings
    AEC-Q200
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