TFBS4711-TT1

Intel TFBS4711-TT1

Part No:

TFBS4711-TT1

Manufacturer:

Intel

Datasheet:

-

Package:

-

AINNX NO:

31960219-TFBS4711-TT1

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8542.39.00.01
  • Automotive
    No
  • PPAP
    No
  • Peak Wavelength (nm)
    900(Max)
  • Maximum Communication Distance (cm)
    100(Typ)
  • Radiant Intensity (mW/sr)
    60
  • Half Intensity Angle Degrees (°)
    48
  • Pulse Width (us)
    2
  • Maximum Rise Time (ns)
    300
  • Maximum Fall Time (ns)
    300
  • Maximum Forward Current (mA)
    80
  • Minimum Operating Supply Voltage (V)
    2.4
  • Typical Operating Supply Voltage (V)
    2.5|3.3|5
  • Maximum Operating Supply Voltage (V)
    5.5
  • LED Supply Voltage (V)
    -0.5 to 6
  • Minimum Operating Temperature (°C)
    -25
  • Maximum Operating Temperature (°C)
    85
  • Mounting
    Surface Mount
  • Package Height
    3
  • Package Width
    1.9
  • Package Length
    6
  • PCB changed
    6
  • Standard Package Name
    SMD
  • Supplier Package
    SMD
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape and Reel
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Type
    TX/RX
  • Pin Count

    a count of all of the component leads (or pins)

    6
  • Dimensions (mm)
    6x3x1.9
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