PEB3081FV14XP

Intel PEB3081FV14XP

Part No:

PEB3081FV14XP

Manufacturer:

Intel

Datasheet:

-

Package:

-

AINNX NO:

31960228-PEB3081FV14XP

Description:

Products specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8542330001
  • Automotive
    No
  • PPAP
    No
  • Category
    S/T
  • Transmission Data Rate (Kbps)
    192
  • Number of Line Interfaces
    1
  • Minimum Operating Supply Voltage (V)
    3.135
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.465
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    70
  • Mounting
    Surface Mount
  • Package Height
    1
  • Package Width
    7
  • Package Length
    7
  • PCB changed
    48
  • Standard Package Name
    QFP
  • Supplier Package
    TQFP
  • Lead Shape
    Gull-wing
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Pin Count

    a count of all of the component leads (or pins)

    48
  • Control Interface
    HDLC
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