P1172BCL
40-DIP
43388918-P1172BCL
IC NUMERICALLY CONT OSC 40-DIP
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
a group of products which fulfill a similar need for a market segment or market as a whole.
a particular group of related products.