Intel MYP1UPDB

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Lead, Tin

RoHS

Compliant

Factory Pack QuantityFactory Pack Quantity

1

Part # Aliases

99A2D8

Manufacturer

Intel

Brand

Intel

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel

Tolerance

1 %

Temperature Coefficient

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

50 ppm/°C

Resistance

71.5 Ω

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

125 °C

Min Operating Temperature

-55 °C

Composition

Thin Film

Subcategory

Development Tools

Power Rating

250 mW

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Power Management IC Development Tools

Product Category

a particular group of related products.

Power Management IC Development Tools

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No