Intel GL82HM175 S R30W

Category

PROCESSOR SOLUTION

Rad Hardened

No

TDP - Max

2.6 W

Integrated Graphics

Without Graphics

PCIe Revision

Revision 3.0

USB Revision

Revision 2.0/3.0

Number of USB Ports

14

Factory Pack QuantityFactory Pack Quantity

725

Mounting Styles

SMD/SMT

Code Name

Skylake

Part # Aliases

952186

Manufacturer

Intel

Number of SATA Ports

4

Brand

Intel

PCIe Configurations

16 Lanes, x1, x2, x4

Number of Displays Supported

3 Display

Embedded Options

Embedded

RoHS

Details

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Type

PCH

Subcategory

Chipsets

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Chipsets

Product

Mobile Chipsets

Product Category

a particular group of related products.

Chipsets

Width

23 mm

Length

23 mm