IS43TR82560CL-125KBL

Integrated Silicon Solution, Inc. (ISSI) IS43TR82560CL-125KBL

Part No:

IS43TR82560CL-125KBL

Datasheet:

-

Package:

78-TFBGA

AINNX NO:

32566561-IS43TR82560CL-125KBL

Description:

2G, 1.35V, Ddr3L, 256Mx8, 1600Mt/s @ 11-11-11, 78 Ball Bga (8Mm X10.5Mm) Rohs, It

Products specifications
  • Factory Lead Time
    10 Weeks
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Mounting Type
    Surface Mount
  • Package / Case
    78-TFBGA
  • Supplier Device Package
    78-TWBGA (8x10.5)
  • Number of Terminals
    78
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Reflow Temperature-Max (s)
    10
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH
  • Package Shape
    RECTANGULAR
  • Package Code
    TFBGA
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 °C
  • Number of Words Code
    256000000
  • Number of Words
    268435456 words
  • Moisture Sensitivity Levels
    3
  • Risk Rank
    5.6
  • Package Description
    TFBGA,
  • Ihs Manufacturer
    INTEGRATED SILICON SOLUTION INC
  • Part Life Cycle Code
    Active
  • Rohs Code
    Yes
  • Manufacturer Part Number
    IS43TR82560CL-125KBL
  • Maximum Clock Rate
    800 MHz
  • Supplier Package
    TWBGA
  • Number of I/O Lines
    8 Bit
  • Mounting
    Surface Mount
  • Package
    Bulk
  • Mfr
    ISSI, Integrated Silicon Solution Inc
  • Product Status
    Active
  • Memory Types
    Volatile
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    242
  • Mounting Styles
    SMD/SMT
  • Brand
    ISSI
  • RoHS
    Details
  • Usage Level
    Commercial grade
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0 to 95 °C
  • Series
    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • JESD-609 Code
    e1
  • ECCN Code
    EAR99
  • Type
    DDR3L SDRAM
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
  • Subcategory
    Memory & Data Storage
  • Voltage - Supply
    1.283V ~ 1.45V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    78
  • JESD-30 Code
    R-PBGA-B78
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.3500 V
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    OTHER
  • Supply Voltage-Min (Vsup)
    1.283 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2Gbit
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Clock Frequency
    800 MHz
  • Access Time
    20 ns
  • Memory Format
    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    Parallel
  • Data Bus Width
    8 Bit
  • Organization
    256MX8
  • Seated Height-Max
    1.2 mm
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    15ns
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    15 Bit
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    DRAM
  • Density
    2 Gbit
  • Memory Density
    2147483648 bit
  • Screening Level
    Commercial
  • Memory IC Type
    DDR DRAM
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    MULTI BANK PAGE BURST
  • Self Refresh
    YES
  • Product Category

    a particular group of related products.

    DRAM
  • Number of Banks
    8
  • Memory Organization
    256M x 8
  • Width
    8 mm
  • Length
    10.5 mm
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