IS43R16320F-5TL

Integrated Silicon Solution, Inc. (ISSI) IS43R16320F-5TL

Part No:

IS43R16320F-5TL

Datasheet:

-

Package:

66-TSSOP (0.400, 10.16mm Width)

AINNX NO:

32566886-IS43R16320F-5TL

Description:

DRAM Chip DDR SDRAM 512M-Bit 32Mx16 200MHz 5ns Speed 2.5V/2.6V 0 to 70°C 66-Pin TSOP-II

Products specifications
  • Factory Lead Time
    8 Weeks
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Mounting Type
    Surface Mount
  • Package / Case
    66-TSSOP (0.400, 10.16mm Width)
  • Supplier Device Package
    66-TSOP II
  • Number of Terminals
    66
  • Manufacturer Part Number
    IS43R16320F-5TL
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    INTEGRATED SILICON SOLUTION INC
  • Package Description
    TSOP2,
  • Risk Rank
    5.59
  • Access Time-Max
    0.7 ns
  • Number of Words
    33554432 words
  • Number of Words Code
    32000000
  • Operating Temperature-Max
    70 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    TSOP2
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Package
    Bulk
  • Mfr
    ISSI, Integrated Silicon Solution Inc
  • Product Status
    Active
  • Memory Types
    Volatile
  • Moisture Sensitive
    Yes
  • Factory Pack QuantityFactory Pack Quantity
    108
  • Mounting Styles
    SMD/SMT
  • Brand
    ISSI
  • RoHS
    Details
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0°C ~ 70°C (TA)
  • Series
    -
  • ECCN Code
    EAR99
  • Type
    SDRAM - DDR
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
  • Subcategory
    Memory & Data Storage
  • Voltage - Supply
    2.3V ~ 2.7V
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PDSO-G66
  • Supply Voltage-Max (Vsup)
    2.7 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Voltage-Min (Vsup)
    2.3 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512Mbit
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Clock Frequency
    200 MHz
  • Access Time
    700 ps
  • Memory Format
    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SSTL_2
  • Organization
    32MX16
  • Seated Height-Max
    1.2 mm
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    15ns
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    DRAM
  • Memory Density
    536870912 bit
  • Memory IC Type
    DDR DRAM
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    FOUR BANK PAGE BURST
  • Self Refresh
    YES
  • Product Category

    a particular group of related products.

    DRAM
  • Memory Organization
    32M x 16
  • Length
    22.22 mm
  • Width
    10.16 mm
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