IS22ES16G-JCLA1

Integrated Silicon Solution, Inc. (ISSI) IS22ES16G-JCLA1

Part No:

IS22ES16G-JCLA1

Datasheet:

-

Package:

-

AINNX NO:

32569679-IS22ES16G-JCLA1

Description:

NAND Flash Memory with eMMC 5.0 Interface 16GB 0-200MHz Automotive Grade -40 to 85°C 153-Ball FBGA

Products specifications
  • Factory Lead Time
    13 Weeks, 6 Days
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    153
  • Manufacturer Part Number
    IS22ES16G-JCLA1
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    INTEGRATED SILICON SOLUTION INC
  • Package Description
    FBGA-153
  • Risk Rank
    5.78
  • Moisture Sensitivity Levels
    3
  • Number of Words
    17179869184 words
  • Number of Words Code
    16000000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Usage Level
    Automotive grade
  • JESD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.5 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B153
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    16GX8
  • Seated Height-Max
    1 mm
  • Memory Width
    8
  • Memory Density
    137438953472 bit
  • Screening Level
    AEC-Q100
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    FLASH
  • Programming Voltage

    A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

    3.3 V
  • Length
    13 mm
  • Width
    11.5 mm
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