Integrated Device Technology (IDT) ZLED7520ZI1R

Package / Case

DFN

Number of Pins

5

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel

JESD-609 Code

e3

Pbfree Code

yes

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Terminal Finish

Tin (Sn)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

105°C

Min Operating Temperature

-40°C

Peak Reflow Temperature (Cel)

260

Frequency

1MHz

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

5

Number of Outputs

1

Power Dissipation

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

500mW

Max Supply Current

600μA

Current - Output

750mA

Min Input Voltage

6V

Frequency - Switching

1MHz

Max Input Voltage

40V

Width

4mm

Length

4mm

Thickness

800μm

REACH SVHC

No SVHC

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Lead Free