IDT72T36125L5BBI

Integrated Device Technology (IDT) IDT72T36125L5BBI

Part No:

IDT72T36125L5BBI

Datasheet:

-

Package:

-

AINNX NO:

29560778-IDT72T36125L5BBI

Description:

FIFO

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    240
  • Package Description
    BGA, BGA240,18X18,40
  • Package Style
    GRID ARRAY
  • Moisture Sensitivity Levels
    3
  • Number of Words Code
    256000
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA240,18X18,40
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    20
  • Access Time-Max
    3.6 ns
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    IDT72T36125L5BBI
  • Clock Frequency-Max (fCLK)
    200 MHz
  • Number of Words
    262144 words
  • Supply Voltage-Nom (Vsup)
    2.5 V
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Manufacturer
    Integrated Device Technology Inc
  • Part Life Cycle Code
    Active
  • Samacsys Description
    IDT IDT72T36125L5BBI, FIFO Memory, Dual, 256K x 36 bit, Uni-Directional 10ns 200MHz, 2.375 u2192 2.625 V, 240-Pin BGA
  • Ihs Manufacturer
    INTEGRATED DEVICE TECHNOLOGY INC
  • Risk Rank
    5.24
  • Part Package Code
    BGA
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    ASYNCHRONOUS OPERATION ALSO POSSIBLE
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.71
  • Subcategory
    FIFOs
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    not_compliant
  • Pin Count

    a count of all of the component leads (or pins)

    240
  • JESD-30 Code
    S-PBGA-B240
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    2.625 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    1.5/2.5,2.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.375 V
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    0.06 mA
  • Organization
    256KX36
  • Seated Height-Max
    1.97 mm
  • Memory Width
    36
  • Standby Current-Max
    0.01 A
  • Memory Density
    9437184 bit
  • Parallel/Serial
    PARALLEL
  • Memory IC Type
    OTHER FIFO
  • Output Enable
    YES
  • Cycle Time
    5 ns
  • Width
    19 mm
  • Length
    19 mm
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