Integrated Device Technology (IDT) AMB0582C1RJ8

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Copper, Silver, Tin

Mount

Surface Mount

Package / Case

FCBGA

Number of Pins

655

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel

Published

2008

JESD-609 Code

e1

Pbfree Code

no

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

Pin Count

a count of all of the component leads (or pins)

655

Number of Channels

1

Data Rate

Data Rate is defined as the amount of data transmitted during a specified time period over a network. It is the speed at which data is transferred from one device to another or between a peripheral device and the computer. It is generally measured in Mega bits per second(Mbps) or Mega bytes per second(MBps).

4.8 Gbps

Memory IC Type

MEMORY CIRCUIT

Length

24.5mm

Width

19.5mm

Thickness

2.55mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant

Lead Free

Contains Lead