Integrated Device Technology (IDT) 89TTM552BL

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

960

Reflow Temperature-Max (s)

30

Supply Voltage-Nom

1.8 V

Supply Voltage-Max

1.89 V

Package Style

GRID ARRAY

Package Shape

SQUARE

Package Code

BGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

85 °C

Risk Rank

5.66

Package Description

35 X 35 MM, 1 MM PITCH, FPBGA-960

Part Package Code

BGA

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Part Life Cycle Code

Obsolete

Rohs Code

No

Manufacturer Part Number

89TTM552BL

Supply Voltage-Min

1.71 V

JESD-609 Code

e0

ECCN Code

5A991

Terminal Finish

Tin/Lead (Sn/Pb)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

225

Reach Compliance Code

not_compliant

Pin Count

a count of all of the component leads (or pins)

960

JESD-30 Code

S-PBGA-B960

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

uPs/uCs/Peripheral ICs Type

MICROPROCESSOR CIRCUIT

Seated Height-Max

3.29 mm

Width

35 mm

Length

35 mm