NDS36PBA-16IT

Insignis NDS36PBA-16IT

Part No:

NDS36PBA-16IT

Manufacturer:

Insignis

Datasheet:

-

Package:

54-TFBGA

AINNX NO:

39704555-NDS36PBA-16IT

Category:

Memory

Description:

SDR 256MB X16 BGA 8X8(X1.2) PC16

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    54-TFBGA
  • Supplier Device Package
    54-FBGA (8x8)
  • RoHS
    Compliant
  • Package
    Tray
  • Mfr
    Insignis Technology Corporation
  • Product Status
    Active
  • Memory Types
    Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C (TA)
  • Series
    -
  • Tolerance
    1 %
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    100 ppm/°C
  • Resistance
    715 mΩ
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    155 °C
  • Min Operating Temperature
    -55 °C
  • Composition
    Thick Film
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    500 mW
  • Technology
    SDRAM
  • Voltage - Supply
    3V ~ 3.6V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    256Mbit
  • Clock Frequency
    166 MHz
  • Access Time
    5 ns
  • Memory Format
    DRAM
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    LVTTL
  • Write Cycle Time - Word, Page
    12ns
  • Features
    Automotive AEC-Q200, Moisture Resistant
  • Memory Organization
    16M x 16
  • Width
    1.6002 mm
  • Height
    711.2 µm
  • Length
    3.0988 mm
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