Inphi Corporation TLIXF30011-865853

Mounting Type

Surface Mount

Package / Case

868-BGA

Supplier Device Package

868-BGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2008

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Function

Optical Transport Processor

Interface

4-Bit Nibble, SFI-4.1, XSBI