Inphi Corporation HPCS6004C.A0-998954

Mounting Type

Surface Mount

Package / Case

896-FBGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued

Moisture Sensitivity Level (MSL)

4 (72 Hours)

Voltage - Supply

1V 1.8V 2.5V

Reach Compliance Code

compliant

Function

Optical Transport Processor

Interface

SFI-4.1, SFI-4.2, SFI-5.1, XAUI, XFI