Inphi Corporation ELCS3516C.A3-998836

Mounting Type

Surface Mount

Package / Case

400-BGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

CS3516

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Applications

Network Processor

Interface

EBI/EMI, Ethernet, GPIO, HPI, I2C, I2S, IDE, IrDA, LPC, PCI, PCM, SATA, UART/USART, USB

RAM Size

External

Core Processor

ARM9®

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

External Program Memory